本規(guī)范共分8章和1個附錄,主要技術(shù)內(nèi)容包括:總則,術(shù)語,基本規(guī)定,低溫共燒陶瓷及厚膜基板制造工藝設(shè)備安裝、調(diào)試及試運行,薄膜基板制造工藝設(shè)備安裝、調(diào)試及試運行,組裝封裝工藝設(shè)備安裝、調(diào)試及試運行,工藝檢測設(shè)備安裝、調(diào)試及試運行,工程驗收等。

GB51037-2014······1

1 總 則······13

2 術(shù) 語······14

3 基本規(guī)定······16

3.1 施工條件······16

3.2 設(shè)備開箱······17

3.3 設(shè)備搬運······17

3.4 設(shè)備安裝······18

3.5 設(shè)備調(diào)試與試運行······19

4 低溫共燒陶瓷及厚膜基板制造工藝設(shè)備安裝、調(diào)試及試運行······21

4.1 一般規(guī)定······21

4.2 流延機······21

4.3 切片機······22

4.4 生瓷打孔機······22

4.5 激光打孔機······23

4.6 微孔填充機······24

4.7 絲網(wǎng)印刷機······25

4.8 疊片機······25

4.9 等靜壓層壓機······27

4.10 熱切機······27

4.11 低溫共燒陶瓷燒結(jié)爐······28

4.12 厚膜燒結(jié)爐······29

4.13 激光調(diào)阻機······29

5 薄膜基板制造工藝設(shè)各安裝、調(diào)試及試運行······30

5.1 一般規(guī)定······30

5.2 磁控濺射鍍膜機······30

5.3 真空蒸發(fā)鍍膜機······31

5.4 化學(xué)氣相淀積系統(tǒng)······33

5.5 旋涂及熱板系統(tǒng)······34

5.6 曝光機······35

5.7 顯影臺······36

5.8 反應(yīng)離子刻蝕機······37

5.9 化學(xué)機械拋光機······38

6 組裝封裝工藝設(shè)備安裝、調(diào)試及試運行······40

6.1 一般規(guī)定······40

6.2 芯片粘片機······40

6.3 芯片共晶焊機······41

6.4 共晶爐······41

6.5 引線鍵合機······42

6.6 倒裝焊機······43

6.7 等離子清洗機······43

6.8 選擇性涂覆機······44

6.9 平行縫焊機······44

6.10 儲能焊機······45

6.11 激光焊機······46

7 工藝檢測設(shè)備安裝、調(diào)試及試運行······48

7.1 一般規(guī)定······48

7.2 飛針測試系統(tǒng)······48

7.3 聲學(xué)掃描檢測系統(tǒng)······49

7.4 3D光學(xué)測量儀······49

7.5 自動光學(xué)檢查儀······50

7.6 激光測厚儀······50

7.7 X射線檢查儀······51

7.8 芯片剪切力/引線拉力測試儀······51

8 工程驗收······53

8.1 一般規(guī)定······53

8.2 交接驗收······53

8.3 竣工驗收······54

8.4 驗收不合格的處置······55

附錄A 微組裝生產(chǎn)線工藝設(shè)備安裝工程驗收記錄用表······56

本規(guī)范用詞說明······61

引用標(biāo)準(zhǔn)名錄······62

附：條文說明······63

1 總 則······67

3 基本規(guī)定······69

3.1 施工條件······69

3.2 設(shè)備開箱······69

3.3 設(shè)備搬運······70

3.4 設(shè)備安裝······70

3.5 設(shè)備調(diào)試與試運行······72

4 低溫共燒陶瓷及厚膜基板制造工藝設(shè)備安裝、調(diào)試及試運行······74

4.1 一般規(guī)定······74

4.2 流延機······74

4.3 切片機······75

4.4 生瓷打孔機······75

4.5 激光打孔機······75

4.7 絲網(wǎng)印刷機······76

4.9 等靜壓層壓機······76

4.11 低溫共燒陶瓷燒結(jié)爐······77

4.12 厚膜燒結(jié)爐······77

4.13 激光調(diào)阻機······77

5 薄膜基板制造工藝設(shè)各安裝、調(diào)試及試運行······78

5.1 一般規(guī)定······78

5.2 磁控濺射鍍膜機······78

5.3 真空蒸發(fā)鍍膜機······79

5.4 化學(xué)氣相淀積系統(tǒng)······79

5.5 旋涂及熱板系統(tǒng)······80

5.6 曝光機······80

5.7 顯影臺······80

5.8 反應(yīng)離子刻蝕機······81

5.9 化學(xué)機械拋光機······81

6 組裝封裝工藝設(shè)備安裝、調(diào)試及試運行······82

6.1 一般規(guī)定······82

6.2 芯片粘片機······82

6.3 芯片共晶焊機······83

6.4 共晶爐······83

6.5 引線鍵合機······83

6.6 倒裝焊機······83

6.8 選擇性涂覆機······84

6.9 平行縫焊機······84

6.11 激光焊機······84

7 工藝檢測設(shè)備安裝、調(diào)試及試運行······85

7.1 一般規(guī)定······85

7.2 飛針測試系統(tǒng)······85

7.3 聲學(xué)掃描檢測系統(tǒng)······85

7.6 激光測厚儀······86

7.7 X射線檢查儀······86

8 工程驗收······87

8.1 一般規(guī)定······87

8.2 交接驗收······88

8.3 竣工驗收······89

8.4 驗收不合格的處置······89